Unit of Competency Mapping – Information for Teachers/Assessors – Information for Learners

MEA262B Mapping and Delivery Guide
Modify_repair aircraft component single layer printed circuit boards

Version 1.0
Issue Date: April 2024


Qualification -
Unit of Competency MEA262B - Modify_repair aircraft component single layer printed circuit boards
Description This unit of competency is part of the Avionic Certificate IV training pathways. It covers the competencies required to modify or repair single layer printed circuit boards. The unit is used in workplaces that operate under the airworthiness regulatory systems of the ADF and CASA.
Employability Skills This unit contains employability skills.
Learning Outcomes and Application This unit requires application of hand skills including high reliability hand soldering and knowledge of standard practices and techniques in the repair of single layer printed circuit boards.Applications include circuit boards from aircraft avionic components that are repaired in aviation workshops.
Duration and Setting X weeks, nominally xx hours, delivered in a classroom/online/blended learning setting.
Prerequisites/co-requisites MEA260B Use electrical test equipmentMEA261C Use electronic test equipment Not applicable
Competency Field
Development and validation strategy and guide for assessors and learners Student Learning Resources Handouts
Activities 		Slides
PPT 		Assessment 1 Assessment 2 Assessment 3 Assessment 4
Elements of Competency Performance Criteria              
Element: Inspect single layer printed circuit cards and associated components
  • Relevant maintenance documentation, including component defect reports where applicable, is interpreted and matched by part and serial number
  • Preparation of work area and circuit card assemblies is appropriate to allow for effective detailed inspection of all substrate, circuit tracks, edge connectors and attached components, taking into account any static discharge procedures
  • Circuit card assemblies are visually or physically inspected for physical integrity of substrate, circuit tracks, edge connectors and attached components
  • Modification status is established to assist in determining repair requirements
  • Defects are correctly identified and reported
       
Element: Test single layer printed circuit cards and associated components
  • Circuit card assemblies are correctly prepared and connected to the appropriate test facility in accordance with approved procedures, or circuit card assemblies are correctly prepared and connected in situ to allow required test procedures to be performed
  • Circuit card assemblies are functionally tested in accordance with normal trade practice and approved maintenance documentation for evidence of serviceability or malfunction
  • Circuit card assemblies, attached hardware and electronic components are electronically and/or physically adjusted/aligned in accordance with maintenance manuals or other prescribed procedures
       
Element: Troubleshoot single layer printed circuit cards and associated components
  • Maintenance documentation, physical inspection and test results are used, where applicable, to assist in fault determination
  • Maintenance manual fault diagnosis guides, logical processes and test equipment are used appropriately to ensure efficient and accurate troubleshooting
  • Component faults are located and the causes of the faults are clearly identified and recorded in maintenance documentation, where required
  • Rectification requirements are determined
       
Element: Dismantle single layer printed circuit cards and associated components
  • Conformal/protective coatings are removed from the circuit card assembly to the extent required to effect necessary repairs and in accordance with maintenance manuals, industry or enterprise standards as applicable
  • Appropriate OHS precautions are observed at all times during maintenance procedure
  • Circuit card assembly is dismantled to the extent necessary to allow repair of all identified faults
  • Parts for processing are correctly tagged and despatched
  • Parts for retention and re-fitment are correctly packaged and stored in accordance with approved procedures to avoid physical and electrostatic damage
  • Parts for disposal are correctly packaged and processed to accord with statutory requirements pertaining to dangerous goods
       
Element: Assemble single layer printed circuit cards and associated components
  • Parts removed for access, and replacement parts, are collected ensuring appropriate modification status, component tolerances and assembly configuration is maintained
  • Printed circuit card and associated components are assembled in accordance with maintenance manuals, and all electrical joints meet the approved standard of the equipment manufacturer, or industry standard, as appropriate
       
Element: Circuit substrate material, circuit tracks, edge connectors and through-hole eyelets are reworked, as necessary, to restore printed circuit card to a serviceable condition
  • Any conformal/protective coatings removed are replaced to the approved standard of the equipment manufacturer, or industry standard, as appropriate
       
Element: Rework techniques are in accordance with industry approval procedures and relevant OHS requirements are observed
       


Evidence Required

List the assessment methods to be used and the context and resources required for assessment. Copy and paste the relevant sections from the evidence guide below and then re-write these in plain English.

The Evidence Guide provides advice on assessment and must be read in conjunction with the performance criteria, required skills and knowledge, range statement and the Assessment Guidelines for the Training Package.

Overview of assessment

A person who demonstrates competency in this unit must be able to repair single layer circuit boards in accordance with procedures and standards while applying all relevant safety precautions.

Critical aspects for assessment and evidence required to demonstrate competency in this unit

It is essential that substrate abrasion and rebuilding techniques, and precautions associated with handling and assembly of electrostatic and temperature sensitive devices are fully observed, understood and complied with. A high level of awareness of safety precautions associated with beryllium materials and use of fluxes and solvents is to be demonstrated.

Evidence of transferability of skills and knowledge related to single layer printed circuit card assembly and repair is essential before undertaking any action. This may be demonstrated through application of the techniques involved across a representative range of circuit card substrate materials and attached components. The work plan should take account of applicable safety and quality requirements in accordance with the industry and regulatory standards. Use of high precision, high reliability soldering techniques and handling of components, including application of anti-static equipment, must be demonstrated.

A person cannot be assessed as competent until it can be demonstrated to the satisfaction of the workplace assessor that the relevant elements of the unit of competency are being achieved under routine supervision on a representative range of cards with various substrate materials and components. This shall be established via the records in the Log of Industrial Experience and Achievement or, where appropriate, an equivalent Industry Evidence Guide.

Context of and specific resources for assessment

Competency should be assessed in the work environment or simulated work environment, using tools and equipment specified in maintenance manuals. It is also expected that general and special purpose test equipment found in most routine situations would be used where appropriate.

Method of assessment

Guidance information for assessment

Submission Requirements

List each assessment task's title, type (eg project, observation/demonstration, essay, assignment, checklist) and due date here

Assessment task 1: [title]      Due date:

(add new lines for each of the assessment tasks)

Assessment Tasks

Copy and paste from the following data to produce each assessment task. Write these in plain English and spell out how, when and where the task is to be carried out, under what conditions, and what resources are needed. Include guidelines about how well the candidate has to perform a task for it to be judged satisfactory.

Required skills

Look for evidence that confirms skills in:

applying relevant OHS practices

using approved repair procedures and processes relating to single and double sided circuit cards

recognising unacceptable soldered connections, damage circuit card components, circuit tracks integrity, substrate damage and edge connector condition

applying static-safe work area practices

reworking unacceptable PCB soldered connections, via acceptable de-soldering and soldering techniques

disassembling and assembling PCB cards to approved industry standards and prescribed specifications

performing PCB tests using relevant test equipment and processes to isolate PCB track faults and assess serviceability state post-repair

correctly disassembling, preparing repair area, reworking the card to industry standards, replacing faulted components and assembling card for post-repair inspection and testing

Required knowledge

Look for evidence that confirms knowledge of:

component operation

basic principles/functions relating to electrical and electronic components on PCBs

substrate materials

types of conformal coating

types of soldering equipment and solders used in track repair and component assembly

how to obtain MSDS

OHS procedures

relevant maintenance manuals

relevant regulatory requirements and standard procedures

The range statement relates to the unit of competency as a whole. It allows for different work environments and situations that may affect performance. Bold italicised wording, if used in the performance criteria, is detailed below. Essential operating conditions that may be present with training and assessment (depending on the work situation, needs of the candidate, accessibility of the item, and local industry and regional contexts) may also be included.

Circuit card components

Attached components include:

capacitors, resistors, wires, semiconductors, inductors, transformers, switches, connectors, multi-pin ICs, terminal posts and heat-sink materials and will include electrostatic sensitive devices

Application of this unit may relate to:

scheduled or unscheduled maintenance activities

individual or team-related activities

single layer printed circuit card assemblies with substrates made from fibreglass, phenolic, composite fibre and epoxy resins and coatings that are from a wide range of aircraft systems

Procedures and standards

Procedures and standards for repair of printed circuit card assemblies include:

a range of general engineering hand skills in addition to specific high reliability soldering skills

standards applicable in a given situation will be defined by equipment manufacturers and/or regulatory authorities and the enterprise

Copy and paste from the following performance criteria to create an observation checklist for each task. When you have finished writing your assessment tool every one of these must have been addressed, preferably several times in a variety of contexts. To ensure this occurs download the assessment matrix for the unit; enter each assessment task as a column header and place check marks against each performance criteria that task addresses.

Observation Checklist

Tasks to be observed according to workplace/college/TAFE policy and procedures, relevant legislation and Codes of Practice Yes No Comments/feedback
Relevant maintenance documentation, including component defect reports where applicable, is interpreted and matched by part and serial number 
Preparation of work area and circuit card assemblies is appropriate to allow for effective detailed inspection of all substrate, circuit tracks, edge connectors and attached components, taking into account any static discharge procedures 
Circuit card assemblies are visually or physically inspected for physical integrity of substrate, circuit tracks, edge connectors and attached components 
Modification status is established to assist in determining repair requirements 
Defects are correctly identified and reported 
Circuit card assemblies are correctly prepared and connected to the appropriate test facility in accordance with approved procedures, or circuit card assemblies are correctly prepared and connected in situ to allow required test procedures to be performed 
Circuit card assemblies are functionally tested in accordance with normal trade practice and approved maintenance documentation for evidence of serviceability or malfunction 
Circuit card assemblies, attached hardware and electronic components are electronically and/or physically adjusted/aligned in accordance with maintenance manuals or other prescribed procedures 
Maintenance documentation, physical inspection and test results are used, where applicable, to assist in fault determination 
Maintenance manual fault diagnosis guides, logical processes and test equipment are used appropriately to ensure efficient and accurate troubleshooting 
Component faults are located and the causes of the faults are clearly identified and recorded in maintenance documentation, where required 
Rectification requirements are determined 
Conformal/protective coatings are removed from the circuit card assembly to the extent required to effect necessary repairs and in accordance with maintenance manuals, industry or enterprise standards as applicable 
Appropriate OHS precautions are observed at all times during maintenance procedure 
Circuit card assembly is dismantled to the extent necessary to allow repair of all identified faults 
Parts for processing are correctly tagged and despatched 
Parts for retention and re-fitment are correctly packaged and stored in accordance with approved procedures to avoid physical and electrostatic damage 
Parts for disposal are correctly packaged and processed to accord with statutory requirements pertaining to dangerous goods 
Parts removed for access, and replacement parts, are collected ensuring appropriate modification status, component tolerances and assembly configuration is maintained 
Printed circuit card and associated components are assembled in accordance with maintenance manuals, and all electrical joints meet the approved standard of the equipment manufacturer, or industry standard, as appropriate 
Any conformal/protective coatings removed are replaced to the approved standard of the equipment manufacturer, or industry standard, as appropriate 
 

Forms

Assessment Cover Sheet

MEA262B - Modify_repair aircraft component single layer printed circuit boards
Assessment task 1: [title]

Student name:

Student ID:

I declare that the assessment tasks submitted for this unit are my own work.

Student signature:

Result: Competent Not yet competent

Feedback to student

 

 

 

 

 

 

 

 

Assessor name:

Signature:

Date:

Assessment Record Sheet

MEA262B - Modify_repair aircraft component single layer printed circuit boards

Student name:

Student ID:

Assessment task 1: [title] Result: Competent Not yet competent

(add lines for each task)

Feedback to student:

 

 

 

 

 

 

 

 

Overall assessment result: Competent Not yet competent

Assessor name:

Signature:

Date:

Student signature:

Date: